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Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below

Date

2015
Proceedings Paper
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dc.contributor.authorLi, Yunlong
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorRoussel, Philippe
dc.contributor.authorBrouri, Mohand
dc.contributor.authorGopinath, Sanjay
dc.contributor.authorAnjos, Daniela M.
dc.contributor.authorThorum, Matthew
dc.contributor.authorYu, Jengyi
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-22T20:35:42Z
dc.date.available2021-10-22T20:35:42Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25559
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325592
dc.source.beginpage327
dc.source.conferenceInternational Interconnect Technology Conference - IITC and Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate18/05/2015
dc.source.conferencelocationGrenoble France
dc.source.endpage330
dc.title

Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below

dc.typeProceedings paper
dspace.entity.typePublication
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