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Articles
Wafer-level packaging for RF passive integration
Publication:
Wafer-level packaging for RF passive integration
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Date
2005-11
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Carchon, Geert
;
Linten, Dimitri
;
Dupuis, Olivier
;
Decoutere, Stefaan
Journal
OnBoard Technology
Abstract
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1986
since deposited on 2021-10-16
Acq. date: 2025-12-11
Citations
Metrics
Views
1986
since deposited on 2021-10-16
Acq. date: 2025-12-11
Citations