Publication:
Wafer-level packaging for RF passive integration
Date
| dc.contributor.author | Carchon, Geert | |
| dc.contributor.author | Linten, Dimitri | |
| dc.contributor.author | Dupuis, Olivier | |
| dc.contributor.author | Decoutere, Stefaan | |
| dc.contributor.imecauthor | Linten, Dimitri | |
| dc.contributor.imecauthor | Decoutere, Stefaan | |
| dc.contributor.orcidimec | Linten, Dimitri::0000-0001-8434-1838 | |
| dc.contributor.orcidimec | Decoutere, Stefaan::0000-0001-6632-6239 | |
| dc.date.accessioned | 2021-10-16T00:53:13Z | |
| dc.date.available | 2021-10-16T00:53:13Z | |
| dc.date.issued | 2005-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10184 | |
| dc.source.beginpage | 60 | |
| dc.source.endpage | 63 | |
| dc.source.journal | OnBoard Technology | |
| dc.title | Wafer-level packaging for RF passive integration | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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