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Conference contributions
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
Publication:
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer
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Date
2016
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Roda Neve, Cesar
;
Detalle, Mikael
;
Nolmans, Philip
;
Li, Yunlong
;
De Vos, Joeri
;
Van der Plas, Geert
;
Beyer, Gerald
;
Beyne, Eric
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1972
since deposited on 2021-10-23
2
last month
Acq. date: 2025-12-13
Citations
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Views
1972
since deposited on 2021-10-23
2
last month
Acq. date: 2025-12-13
Citations