Publication:

High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer

Date

2016
Proceedings Paper
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dc.contributor.authorRoda Neve, Cesar
dc.contributor.authorDetalle, Mikael
dc.contributor.authorNolmans, Philip
dc.contributor.authorLi, Yunlong
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T14:17:06Z
dc.date.available2021-10-23T14:17:06Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27224
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7970024/
dc.source.beginpage1
dc.source.conferenceIEEE International Conference on 3D System Integration - 3DIC
dc.source.conferencedate8/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage4
dc.title

High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer

dc.typeProceedings paper
dspace.entity.typePublication
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