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Multilayer thin film technology, enabling technology for system-in-a-package (SIP) and "above-IC" heterogenous sytem-on-chip (SOC) solutions
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1855 since deposited on 2021-10-16
2last month
Acq. date: 2025-12-15
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Metrics
Views
1855 since deposited on 2021-10-16
2last month
Acq. date: 2025-12-15
Citations