Publication:
Multilayer thin film technology, enabling technology for system-in-a-package (SIP) and "above-IC" heterogenous sytem-on-chip (SOC) solutions
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-16T00:46:11Z | |
| dc.date.available | 2021-10-16T00:46:11Z | |
| dc.date.issued | 2005-04 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10097 | |
| dc.source.beginpage | 14 | |
| dc.source.conference | Proceedings of the International Conference on Electronics Packaging - ICEP | |
| dc.source.conferencedate | 13/04/2005 | |
| dc.source.conferencelocation | Tokyo Japan | |
| dc.source.endpage | 21 | |
| dc.title | Multilayer thin film technology, enabling technology for system-in-a-package (SIP) and "above-IC" heterogenous sytem-on-chip (SOC) solutions | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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