Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Presentations
Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream?
Publication:
Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream?
Copy permalink
Date
2004
Presentation
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
1892
since deposited on 2021-10-15
2
last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1892
since deposited on 2021-10-15
2
last month
Acq. date: 2025-12-15
Citations