Publication:
Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream?
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T12:43:17Z | |
| dc.date.available | 2021-10-15T12:43:17Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/8577 | |
| dc.source.conference | IMAPS-France, Interconex | |
| dc.source.conferencedate | 4/05/2004 | |
| dc.source.conferencelocation | Versailles France | |
| dc.title | Ultradense packaging aspects. 3D interconnection and packaging: impending reality or still a dream? | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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