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Integration of ultralow-k dielectrics using a template replacement approach

Date

2017
Meeting abstract
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dc.contributor.authorZhang, Liping
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorHeylen, Nancy
dc.contributor.authorZha, Lichen
dc.contributor.authorWu, Chen
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorLefferts, Scott
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorZha, Lichen
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-24T19:59:30Z
dc.date.available2021-10-24T19:59:30Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30020
dc.identifier.urlhttp://www.mrs.org/technical-programs/programs_abstracts/2017_mrs_spring_meeting_exhibit/ed9/ed9_3_2/ed9_3_04_3
dc.source.beginpageED9.3
dc.source.conferenceMRS Spring Meeting Sympsoium E: Advanced Interconnects for Logic and Memory Applications : Materials, Processes and Integration
dc.source.conferencedate17/04/2017
dc.source.conferencelocationPhoenix, AZ USA
dc.title

Integration of ultralow-k dielectrics using a template replacement approach

dc.typeMeeting abstract
dspace.entity.typePublication
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