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Scalability and reliability of TaN/HfN/HfO2 gate stack fabricated by a high temperature process
Publication:
Scalability and reliability of TaN/HfN/HfO2 gate stack fabricated by a high temperature process
Date
2005
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kang, JinFeng
;
Yu, HongYu
;
Ren, C.
;
Yang, H.
;
Sa, N.
;
Liu, X.Y.
;
Han, R.Q.
;
Li, M.F.
;
Chan, D.S.H.
;
Kwong, D.L.
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1976
since deposited on 2021-10-16
Acq. date: 2025-10-24
Citations
Metrics
Views
1976
since deposited on 2021-10-16
Acq. date: 2025-10-24
Citations