Publication:

Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects

Date

2013
Proceedings Paper
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dc.contributor.authorCroes, Kristof
dc.contributor.authorLi, Yunlong
dc.contributor.authorLofrano, Melina
dc.contributor.authorWilson, Chris
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.date.accessioned2021-10-21T07:05:19Z
dc.date.available2021-10-21T07:05:19Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22187
dc.source.beginpage2C.3
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate14/04/2013
dc.source.conferencelocationMonterey, CA USA
dc.title

Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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