Publication:
SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-off
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1892 since deposited on 2021-10-17
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Acq. date: 2025-10-25
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Views
1892 since deposited on 2021-10-17
464item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations