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SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-off

Date

2008
Proceedings Paper
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dc.contributor.authorDross, Frederic
dc.contributor.authorMilhe, Aurelien
dc.contributor.authorRobbelein, Jo
dc.contributor.authorGordon, Ivan
dc.contributor.authorBouchard, Pierre-Olivier
dc.contributor.authorBeaucarne, Guy
dc.contributor.authorPoortmans, Jef
dc.contributor.imecauthorGordon, Ivan
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.orcidimecGordon, Ivan::0000-0002-0713-8403
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.date.accessioned2021-10-17T06:57:05Z
dc.date.available2021-10-17T06:57:05Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13676
dc.source.beginpage1278
dc.source.conference23rd European Photovoltaic Energy Conference - EPVSEC
dc.source.conferencedate1/09/2008
dc.source.conferencelocationValencia Spain
dc.source.endpage1281
dc.title

SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-off

dc.typeProceedings paper
dspace.entity.typePublication
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