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Surface properties restoration and passivation of high porosity ultra low-k dielectric (k~2.3) after direct-CMP

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dc.contributor.authorSinapi, Fabrice
dc.contributor.authorHeylen, Nancy
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVereecke, Guy
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorKesters, Els
dc.contributor.authorVan Hoeymissen, Jan
dc.contributor.authorHernandez, Jose Luis
dc.contributor.authorBeyer, Gerald
dc.contributor.authorFisher, P.
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVereecke, Guy
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorHernandez, Jose Luis
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-16T19:48:21Z
dc.date.available2021-10-16T19:48:21Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12912
dc.source.beginpage2620
dc.source.endpage2623
dc.source.issue11
dc.source.journalMicroelectronic Engineering
dc.source.volume84
dc.title

Surface properties restoration and passivation of high porosity ultra low-k dielectric (k~2.3) after direct-CMP

dc.typeJournal article
dspace.entity.typePublication
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