Publication:

Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

Date

2024
Journal article
https://doi.org/10.35848/1347-4065/ad32e2
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Author(s)

Karve, Gauri  
;
Li, Yunlong
;
Motsnyi, Vasyl
;
Wei, Wei
;
Visker, Jakob
;
Chancerel, Francois
;
Ackaert, Jan
;
Puybaret, Renaud
;
Dutta, Barundeb
;
Sabuncuoglu Tezcan, Deniz
;
Peng, Lan
;
Soussan, Philippe
;
Severi, Simone
;
Osman, Haris  

Journal

JAPANESE JOURNAL OF APPLIED PHYSICS

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632 since deposited on 2024-04-14
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Acq. date: 2026-10-08

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