Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

Karve, Gauri; Li, Yunlong; Motsnyi, Vasyl; Wei, Wei; Visker, Jakob; Chancerel, Francois; Ackaert, Jan; Puybaret, Renaud; Dutta, Barundeb; Sabuncuoglu Tezcan, Deniz; Peng, Lan; Soussan, Philippe; Severi, Simone; Osman, Haris

doi:10.35848/1347-4065/ad32e2

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Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

Date

2024

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https://doi.org/10.35848/1347-4065/ad32e2

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Sabuncuoglu Tezcan, Deniz

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JAPANESE JOURNAL OF APPLIED PHYSICS

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611 since deposited on 2024-04-14

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Acq. date: 2026-02-24

Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

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