Publication:

Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform

Date

2024
Journal article
https://doi.org/10.35848/1347-4065/ad32e2
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Author(s)

Karve, Gauri  
;
Li, Yunlong
;
Motsnyi, Vasyl  
;
Wei, Wei  
;
Visker, Jakob  
;
Chancerel, Francois  
;
Ackaert, Jan  
;
Puybaret, Renaud  
;
Dutta, Barundeb  
;
Sabuncuoglu Tezcan, Deniz  
;
Peng, Lan  
;
Soussan, Philippe  
;
Severi, Simone  
;
Osman, Haris  

Journal

JAPANESE JOURNAL OF APPLIED PHYSICS

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609 since deposited on 2024-04-14
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Acq. date: 2025-12-16

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609 since deposited on 2024-04-14
2last month
Acq. date: 2025-12-16

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