Publication:
Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform
| dc.contributor.author | Karve, Gauri | |
| dc.contributor.author | Li, Yunlong | |
| dc.contributor.author | Motsnyi, Vasyl | |
| dc.contributor.author | Wei, Wei | |
| dc.contributor.author | Visker, Jakob | |
| dc.contributor.author | Chancerel, Francois | |
| dc.contributor.author | Ackaert, Jan | |
| dc.contributor.author | Puybaret, Renaud | |
| dc.contributor.author | Dutta, Barundeb | |
| dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.author | Peng, Lan | |
| dc.contributor.author | Soussan, Philippe | |
| dc.contributor.author | Severi, Simone | |
| dc.contributor.author | Osman, Haris | |
| dc.contributor.imecauthor | Karve, Gauri | |
| dc.contributor.imecauthor | Motsnyi, Vasyl | |
| dc.contributor.imecauthor | Wei, Wei | |
| dc.contributor.imecauthor | Visker, Jakob | |
| dc.contributor.imecauthor | Chancerel, Francois | |
| dc.contributor.imecauthor | Ackaert, Jan | |
| dc.contributor.imecauthor | Puybaret, Renaud | |
| dc.contributor.imecauthor | Dutta, Barundeb | |
| dc.contributor.imecauthor | Peng, Lan | |
| dc.contributor.imecauthor | Soussan, Philippe | |
| dc.contributor.imecauthor | Severi, Simone | |
| dc.contributor.imecauthor | Osman, Haris | |
| dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.orcidimec | Karve, Gauri::0009-0002-7316-5917 | |
| dc.contributor.orcidimec | Motsnyi, Vasyl::0000-0001-5297-9298 | |
| dc.contributor.orcidimec | Wei, Wei::0000-0002-1635-0924 | |
| dc.contributor.orcidimec | Chancerel, Francois::0000-0003-4512-1634 | |
| dc.contributor.orcidimec | Puybaret, Renaud::0000-0002-4946-2658 | |
| dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
| dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
| dc.contributor.orcidimec | Severi, Simone::0009-0005-8734-5646 | |
| dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
| dc.date.accessioned | 2024-09-19T09:56:43Z | |
| dc.date.available | 2024-04-14T16:53:34Z | |
| dc.date.available | 2024-09-19T09:56:43Z | |
| dc.date.issued | 2024 | |
| dc.description.wosFundingText | The authors would like to thank DISCO USA for the collaboration on collective grinding, Prof. Tom van der Donck for his assistance in elemental analysis, and III-V labs at imec for the sample processing. | |
| dc.identifier.doi | 10.35848/1347-4065/ad32e2 | |
| dc.identifier.issn | 0021-4922 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/43825 | |
| dc.publisher | IOP Publishing Ltd | |
| dc.source.beginpage | Art. 04SP42 | |
| dc.source.endpage | N/A | |
| dc.source.issue | 4 | |
| dc.source.journal | JAPANESE JOURNAL OF APPLIED PHYSICS | |
| dc.source.numberofpages | 6 | |
| dc.source.volume | 63 | |
| dc.subject.keywords | INTEGRATION | |
| dc.subject.keywords | HETEROSTRUCTURES | |
| dc.title | Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |