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Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications, using RELACS shrink and corresponding OPC

Date

2007
Proceedings Paper
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dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorVersluijs, Janko
dc.contributor.authorWiaux, Vincent
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorCiofi, Ivan
dc.contributor.authorStruyf, Herbert
dc.contributor.authorHendrickx, Dirk
dc.contributor.authorVan Olmen, Jan
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorWiaux, Vincent
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorHendrickx, Dirk
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.date.accessioned2021-10-16T18:19:44Z
dc.date.available2021-10-16T18:19:44Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12647
dc.source.beginpage65200I
dc.source.conferenceOptical Microlithography XX
dc.source.conferencedate27/02/2007
dc.source.conferencelocationSan Jose, CA USA
dc.title

Manufacturability issues with double patterning for 50-nm half-pitch single damascene applications, using RELACS shrink and corresponding OPC

dc.typeProceedings paper
dspace.entity.typePublication
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