Publication:

Through-silicon via and die stacking technologies for microsystems-integration

Date

2008
Proceedings Paper
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Files

17755.pdf 2.13 MB

Author(s)

Beyne, Eric  
;
De Moor, Piet  
;
Ruythooren, Wouter  
;
Labie, Riet  
;
Jourdain, Anne  
;
Tilmans, Harrie  
;
Sabuncuoglu Tezcan, Deniz  
;
Soussan, Philippe  
;
Swinnen, Bart  
;
Cartuyvels, Rudi  

Journal

Abstract

Description

Statistics

Views

1876 since deposited on 2021-10-17
Acq. date: 2026-05-15

Citations

Statistics

Views

1876 since deposited on 2021-10-17
Acq. date: 2026-05-15

Citations