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Doubling or quadrupling MuGFET Fin integration scheme with higher pattern fidelity, lower CD variation and higher layout efficiency

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dc.contributor.authorRooyackers, Rita
dc.contributor.authorAugendre, Emmanuel
dc.contributor.authorDegroote, Bart
dc.contributor.authorCollaert, Nadine
dc.contributor.authorNackaerts, Axel
dc.contributor.authorDixit, Abhisek
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorPawlak, Bartek
dc.contributor.authorErcken, Monique
dc.contributor.authorKunnen, Eddy
dc.contributor.authorDilliway, Gabriela
dc.contributor.authorLeys, Frederik
dc.contributor.authorLoo, Roger
dc.contributor.authorJurczak, Gosia
dc.contributor.authorBiesemans, Serge
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorPawlak, Bartek
dc.contributor.imecauthorErcken, Monique
dc.contributor.imecauthorLoo, Roger
dc.contributor.imecauthorJurczak, Gosia
dc.contributor.imecauthorBiesemans, Serge
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.date.accessioned2021-10-16T19:10:24Z
dc.date.available2021-10-16T19:10:24Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12804
dc.source.conferenceIEEE International Solid-State Circuits Conference - ISSCC
dc.source.conferencedate11/02/2007
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Doubling or quadrupling MuGFET Fin integration scheme with higher pattern fidelity, lower CD variation and higher layout efficiency

dc.typeOral presentation
dspace.entity.typePublication
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