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Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL)

Date

2017
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dc.contributor.authorChanson, Romain
dc.contributor.authorLefaucheux, Philippe
dc.contributor.authorDussart, Remi
dc.contributor.authorShen, Peng
dc.contributor.authorUrabe, Keiichiro
dc.contributor.authorDussarat, Christian
dc.contributor.authorMaekawa, Kaoru
dc.contributor.authoryatsuda, koichi
dc.contributor.authorTahara, Shigeru
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.date.accessioned2021-10-24T03:23:23Z
dc.date.available2021-10-24T03:23:23Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28003
dc.identifier.urlhttps://www.uantwerpen.be/images/uantwerpen/container2642/files/events/iPlasmaNano-VIII_Programme-booklet.pdf
dc.source.beginpage77
dc.source.conferenceiplasmaNano-VIII: 8th International Conference on Plasma Nanoscience
dc.source.conferencedate2/07/2017
dc.source.conferencelocationAntwerpen Belgium
dc.title

Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL)

dc.typeMeeting abstract
dspace.entity.typePublication
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