Publication:

High-k materials for advanced gate stack dielectrics: a comparison of ALCVD and MOCVD as deposition technologies

Date

2003
Proceedings Paper
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dc.contributor.authorCaymax, Matty
dc.contributor.authorBender, Hugo
dc.contributor.authorBrijs, Bert
dc.contributor.authorConard, Thierry
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorDelabie, Annelies
dc.contributor.authorHeyns, Marc
dc.contributor.authorOnsia, Bart
dc.contributor.authorRagnarsson, Lars-Ake
dc.contributor.authorRichard, Olivier
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorZhao, Chao
dc.contributor.authorMaes, J.W.
dc.contributor.authorDaté, L.
dc.contributor.authorPique, D.
dc.contributor.authorYoung, E.
dc.contributor.authorTsai, W.
dc.contributor.authorShimamoto, Y.
dc.contributor.imecauthorCaymax, Matty
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorDelabie, Annelies
dc.contributor.imecauthorHeyns, Marc
dc.contributor.imecauthorOnsia, Bart
dc.contributor.imecauthorRagnarsson, Lars-Ake
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecRagnarsson, Lars-Ake::0000-0003-1057-8140
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.accessioned2021-10-15T04:07:18Z
dc.date.available2021-10-15T04:07:18Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7298
dc.source.beginpage47
dc.source.conferenceCMOS Front-End Materials and Process Technology
dc.source.conferencedate21/04/2003
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage58
dc.title

High-k materials for advanced gate stack dielectrics: a comparison of ALCVD and MOCVD as deposition technologies

dc.typeProceedings paper
dspace.entity.typePublication
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