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Optimizing the electrodeposition process for filling microvias with copper for 3D-stacked integrated circuits
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1870 since deposited on 2021-10-17
2last month
Acq. date: 2025-12-15
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Metrics
Views
1870 since deposited on 2021-10-17
2last month
Acq. date: 2025-12-15
Citations