Optimizing the electrodeposition process for filling microvias with copper for 3D-stacked integrated circuits

dc.contributor.author	Van Bavel, Mieke
dc.contributor.author	Luhn, Ole
dc.contributor.author	Radisic, Alex
dc.contributor.author	Ruythooren, Wouter
dc.contributor.imecauthor	Van Bavel, Mieke
dc.contributor.imecauthor	Radisic, Alex
dc.contributor.imecauthor	Ruythooren, Wouter
dc.date.accessioned	2021-10-17T11:33:37Z
dc.date.available	2021-10-17T11:33:37Z
dc.date.issued	2008
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/14602
dc.identifier.url	http://www.future-fab.com/documents.asp?d_ID=4546
dc.source.beginpage	112
dc.source.endpage	117
dc.source.issue	27
dc.source.journal	Future Fab
dc.title	Optimizing the electrodeposition process for filling microvias with copper for 3D-stacked integrated circuits
dc.type	Journal article
dspace.entity.type	Publication
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