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Towards 3D integration of system in a package modules
Publication:
Towards 3D integration of system in a package modules
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Date
2008
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Carchon, Geert
;
Posada Quijano, Guillermo
Journal
Euroasia Semiconductor
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1935
since deposited on 2021-10-17
2
last month
Acq. date: 2026-01-08
Citations
Metrics
Views
1935
since deposited on 2021-10-17
2
last month
Acq. date: 2026-01-08
Citations