Publication:
Towards 3D integration of system in a package modules
Date
| dc.contributor.author | Carchon, Geert | |
| dc.contributor.author | Posada Quijano, Guillermo | |
| dc.date.accessioned | 2021-10-17T06:26:40Z | |
| dc.date.available | 2021-10-17T06:26:40Z | |
| dc.date.issued | 2008 | |
| dc.identifier.issn | 1751-1135 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/13478 | |
| dc.source.beginpage | 37 | |
| dc.source.endpage | 40 | |
| dc.source.issue | 1 | |
| dc.source.journal | Euroasia Semiconductor | |
| dc.source.volume | 30 | |
| dc.title | Towards 3D integration of system in a package modules | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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