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Use of Wafer Applied Under Fill for 3D Stacking
Publication:
Use of Wafer Applied Under Fill for 3D Stacking
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Date
2011
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
La Manna, Antonio
;
Rebibis, Kenneth June
;
Gerets, Carine
;
Beyne, Eric
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1872
since deposited on 2021-10-19
Acq. date: 2025-12-15
Citations
Metrics
Views
1872
since deposited on 2021-10-19
Acq. date: 2025-12-15
Citations