Publication:
Use of Wafer Applied Under Fill for 3D Stacking
Date
| dc.contributor.author | La Manna, Antonio | |
| dc.contributor.author | Rebibis, Kenneth June | |
| dc.contributor.author | Gerets, Carine | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | La Manna, Antonio | |
| dc.contributor.imecauthor | Rebibis, Kenneth June | |
| dc.contributor.imecauthor | Gerets, Carine | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-19T15:07:26Z | |
| dc.date.available | 2021-10-19T15:07:26Z | |
| dc.date.issued | 2011 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/19227 | |
| dc.source.conference | IMAPS 44th International Symposium on Microelectronics | |
| dc.source.conferencedate | 9/09/2011 | |
| dc.source.conferencelocation | Long Beach, CA USA | |
| dc.title | Use of Wafer Applied Under Fill for 3D Stacking | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |