Publication:
Impact of Back-End-Of-Line architecture on Chip-Package-Interaction in advanced interconnects using shear microprobing and finite element simulations
Date
Loading...
Files
Journal
Abstract
Description
Statistics
Views
1852 since deposited on 2021-10-26
2last month
1last week
Acq. date: 2026-07-16
Citations
Statistics
Views
1852 since deposited on 2021-10-26
2last month
1last week
Acq. date: 2026-07-16
Citations