Publication:

High spatial resolution measurements of thermo-mechanical stress effects in flip-chip package

Date

2019

Proceedings Paper

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Author(s)

Cherman, Vladimir

;

Lofrano, Melina

;

Gonzalez, Mario

;

Van der Plas, Geert

;

Rebibis, Kenneth June

;

Statistics

1766 since deposited on 2021-10-27

Acq. date: 2026-05-15