Publication:
High spatial resolution measurements of thermo-mechanical stress effects in flip-chip package
Date
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Rebibis, Kenneth June | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Rebibis, Kenneth June | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-27T08:01:18Z | |
| dc.date.available | 2021-10-27T08:01:18Z | |
| dc.date.issued | 2019 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/32702 | |
| dc.source.conference | European Microelectronics and Packaging Conference (EMPC) | |
| dc.source.conferencedate | 16/09/2019 | |
| dc.source.conferencelocation | Pisa Italy | |
| dc.title | High spatial resolution measurements of thermo-mechanical stress effects in flip-chip package | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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