Publication:

Particle removal efficiency and damage analysis on silicon wafers after megasonic cleaning in solvents

Date

2009
Journal article
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dc.contributor.authorBarbagini, Francesca
dc.contributor.authorHalder, Sandip
dc.contributor.authorJanssens, Tom
dc.contributor.authorKenis, Karine
dc.contributor.authorWostyn, Kurt
dc.contributor.authorBearda, Twan
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorLeunissen, Peter
dc.contributor.authorMertens, Paul
dc.contributor.authorKim, Kyung Hyun
dc.contributor.authorAndreas, Michael
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-17T21:19:45Z
dc.date.available2021-10-17T21:19:45Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.issn0169-4243
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14942
dc.source.beginpage1709
dc.source.endpage1721
dc.source.issue12
dc.source.journalJournal of Adhesion Science and Technology
dc.source.volume23
dc.title

Particle removal efficiency and damage analysis on silicon wafers after megasonic cleaning in solvents

dc.typeJournal article
dspace.entity.typePublication
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