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Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests
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Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests
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Date
2003-12
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Labie, Riet
;
Beyne, Eric
;
Mertens, Robert
;
Ratchev, Petar
;
Humbeeck, J.V.
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1903
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Acq. date: 2025-12-15
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Views
1903
since deposited on 2021-10-15
2
last month
Acq. date: 2025-12-15
Citations