Publication:
Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests
Date
| dc.contributor.author | Labie, Riet | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Mertens, Robert | |
| dc.contributor.author | Ratchev, Petar | |
| dc.contributor.author | Humbeeck, J.V. | |
| dc.contributor.imecauthor | Labie, Riet | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Mertens, Robert | |
| dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T05:15:40Z | |
| dc.date.available | 2021-10-15T05:15:40Z | |
| dc.date.issued | 2003-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7763 | |
| dc.source.beginpage | 584 | |
| dc.source.conference | EPTC - Electronics Packaging Technology Conference | |
| dc.source.conferencedate | 10/12/2003 | |
| dc.source.conferencelocation | Singapore Singapore | |
| dc.source.endpage | 588 | |
| dc.title | Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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