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Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture
Publication:
Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture
Date
2020
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sun, Chen
;
Liang, Jie
;
Xu, Haiwen
;
Kong, Eugene
;
Nguyen, Bich-Yen
;
Vandooren, Anne
;
Schwarzenbach, Walter
;
Maleville, Christophe
;
Barral, Vincent
;
Berthelon, Remy
;
Weber, Olivier
;
Arnaud, Franck
;
Thean, Aaron V. Y.
;
Gong, Xiao
Journal
na
Abstract
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1714
since deposited on 2021-11-02
Acq. date: 2025-10-24
Citations
Metrics
Views
1714
since deposited on 2021-11-02
Acq. date: 2025-10-24
Citations