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Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture

Date

2020
Proceedings Paper
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dc.contributor.authorSun, Chen
dc.contributor.authorLiang, Jie
dc.contributor.authorXu, Haiwen
dc.contributor.authorKong, Eugene
dc.contributor.authorNguyen, Bich-Yen
dc.contributor.authorVandooren, Anne
dc.contributor.authorSchwarzenbach, Walter
dc.contributor.authorMaleville, Christophe
dc.contributor.authorBarral, Vincent
dc.contributor.authorBerthelon, Remy
dc.contributor.authorWeber, Olivier
dc.contributor.authorArnaud, Franck
dc.contributor.authorThean, Aaron V. Y.
dc.contributor.authorGong, Xiao
dc.contributor.imecauthorVandooren, Anne
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.date.accessioned2022-01-27T11:59:57Z
dc.date.available2021-11-02T15:59:26Z
dc.date.available2022-01-27T11:58:21Z
dc.date.available2022-01-27T11:59:57Z
dc.date.issued2020
dc.identifier.eisbn978-1-7281-6460-1
dc.identifier.issn0743-1562
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/37756
dc.publisherIEEE
dc.source.conferenceIEEE Symposium on VLSI Technology and Circuits
dc.source.conferencedateJUN 15-19, 2020
dc.source.conferencelocationVirtual
dc.source.journalna
dc.source.numberofpages2
dc.title

Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture

dc.typeProceedings paper
dspace.entity.typePublication
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