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Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
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Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
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Date
2010
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ivankovic, Andrej
;
Vanstreels, Kris
;
Vanderstraeten, Daniel
;
Brizar, Guy
;
Gillon, Renaud
;
Blansaer, Eddy
;
Vandevelde, Bart
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1949
since deposited on 2021-10-18
Acq. date: 2025-12-11
Citations
Metrics
Views
1949
since deposited on 2021-10-18
Acq. date: 2025-12-11
Citations