Publication:
Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages
Date
| dc.contributor.author | Ivankovic, Andrej | |
| dc.contributor.author | Vanstreels, Kris | |
| dc.contributor.author | Vanderstraeten, Daniel | |
| dc.contributor.author | Brizar, Guy | |
| dc.contributor.author | Gillon, Renaud | |
| dc.contributor.author | Blansaer, Eddy | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.imecauthor | Vanstreels, Kris | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-18T17:19:54Z | |
| dc.date.available | 2021-10-18T17:19:54Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17310 | |
| dc.source.conference | 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE | |
| dc.source.conferencedate | 26/04/2010 | |
| dc.source.conferencelocation | Bordeaux France | |
| dc.title | Development of fast and easy methods for measuring the Young's Modulus of molding compounds for IC packages | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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