Publication:
Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach
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443 since deposited on 2024-06-23
13last month
2last week
Acq. date: 2026-08-09
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508 since deposited on 2024-06-23
1last month
Acq. date: 2026-08-09
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