Publication:

Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach

Date

2024
Journal article
https://doi.org/10.3390/electronics13112188
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dc.contributor.authorAlavi, Omid
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorDaenen, Michaël
dc.contributor.imecauthorAlavi, Omid
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorDaenen, Michaël
dc.contributor.orcidimecAlavi, Omid::0000-0001-6426-8485
dc.contributor.orcidimecDe Ceuninck, Ward::0000-0002-4630-5569
dc.contributor.orcidimecDaenen, Michaël::0000-0002-9221-4932
dc.date.accessioned2024-12-18T11:20:28Z
dc.date.available2024-06-23T17:35:14Z
dc.date.available2024-12-18T11:20:28Z
dc.date.embargo2024-06-04
dc.date.issued2024
dc.description.wosFundingTextThis research was notably enhanced by the contributions from Inexeon, who generously provided samples of actual PV inverters. These samples were essential in allowing for comprehensive testing and analysis, deeply enriching our insights into the failures within these systems.
dc.identifier.doi10.3390/electronics13112188
dc.identifier.issn2079-9292
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44075
dc.publisherMDPI
dc.source.beginpageArt. 2188
dc.source.endpageN/A
dc.source.issue11
dc.source.journalELECTRONICS
dc.source.numberofpages32
dc.source.volume13
dc.subject.keywordsMODEL
dc.subject.keywordsCLASSIFICATION
dc.subject.keywordsPREDICTION
dc.subject.keywordsFATIGUE
dc.subject.keywordsMODULES
dc.subject.keywordsRESISTANCE
dc.subject.keywordsNETWORKS
dc.subject.keywordsINVERTER
dc.subject.keywordsMOSFETS
dc.subject.keywordsTIME
dc.title

Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach

dc.typeJournal article
dspace.entity.typePublication
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