Publication:

Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material

Date

2016
Proceedings Paper
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorPotoms, Goedele
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorGuerrero, Alice
dc.contributor.authorDonghun, Bai
dc.contributor.authorXiao, Liu
dc.contributor.authorYess, Kim
dc.contributor.authorArnold, Kim
dc.contributor.authorSpiess, Walter
dc.contributor.authorGriesbach, Tim
dc.contributor.authorRapps, Thomas
dc.contributor.authorLutter, Stefan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T13:42:08Z
dc.date.available2021-10-23T13:42:08Z
dc.date.embargo9999-12-31
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27141
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7545649/?arnumber=7545649
dc.source.beginpage1685
dc.source.conferenceIEEE 66th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage1690
dc.title

Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material

dc.typeProceedings paper
dspace.entity.typePublication
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