Publication:

Optimized selection of materials for IGBT module packaging

Date

2022
Journal article
https://doi.org/10.1016/j.microrel.2022.114736
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Author(s)

Alavi, Omid  
;
De Ceuninck, Ward  
;
Daenen, Michaël  

Journal

MICROELECTRONICS RELIABILITY

Abstract

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1237 since deposited on 2023-01-09
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1237 since deposited on 2023-01-09
1last month
Acq. date: 2026-05-16

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