Publication:

Optimized selection of materials for IGBT module packaging

Date

2022

Journal article

https://doi.org/10.1016/j.microrel.2022.114736

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Author(s)

;

De Ceuninck, Ward

;

Daenen, Michaël

Journal

MICROELECTRONICS RELIABILITY

Statistics

1236 since deposited on 2023-01-09

Acq. date: 2026-02-27