Publication:
Optimized selection of materials for IGBT module packaging
| dc.contributor.author | Alavi, Omid | |
| dc.contributor.author | De Ceuninck, Ward | |
| dc.contributor.author | Daenen, Michaël | |
| dc.contributor.imecauthor | Alavi, Omid | |
| dc.contributor.imecauthor | De Ceuninck, Ward | |
| dc.contributor.imecauthor | Daenen, Michaël | |
| dc.contributor.orcidimec | Alavi, Omid::0000-0001-6426-8485 | |
| dc.contributor.orcidimec | De Ceuninck, Ward::0000-0002-4630-5569 | |
| dc.contributor.orcidimec | Daenen, Michaël::0000-0002-9221-4932 | |
| dc.date.accessioned | 2023-05-25T13:22:02Z | |
| dc.date.available | 2023-01-09T03:12:32Z | |
| dc.date.available | 2023-05-25T13:22:02Z | |
| dc.date.issued | 2022 | |
| dc.description.wosFundingText | This work is (partially) supported by the energy transition funds project "BREGILAB" organized by the FPS economy, S.M.E.s, Self-employed and Energy (Met de steun van het Energietransitiefonds). | |
| dc.identifier.doi | 10.1016/j.microrel.2022.114736 | |
| dc.identifier.issn | 0026-2714 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40949 | |
| dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | |
| dc.source.beginpage | Art. 114736 | |
| dc.source.endpage | na | |
| dc.source.issue | November | |
| dc.source.journal | MICROELECTRONICS RELIABILITY | |
| dc.source.numberofpages | 6 | |
| dc.source.volume | 138 | |
| dc.subject.keywords | THERMODYNAMIC PROPERTIES | |
| dc.subject.keywords | FAILURE MODES | |
| dc.title | Optimized selection of materials for IGBT module packaging | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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