Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
RF characterization and modeling of through-silicon vias
Publication:
RF characterization and modeling of through-silicon vias
Copy permalink
Date
2013
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
26660.pdf
630.65 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sun, Xiao
;
Ryckaert, Julien
;
Van der Plas, Geert
;
Beyne, Eric
Journal
Abstract
Description
Metrics
Views
1837
since deposited on 2021-10-21
Acq. date: 2025-12-15
Citations
Metrics
Views
1837
since deposited on 2021-10-21
Acq. date: 2025-12-15
Citations