Publication:

RF characterization and modeling of through-silicon vias

Date

2013
Proceedings Paper
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dc.contributor.authorSun, Xiao
dc.contributor.authorRyckaert, Julien
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T12:28:21Z
dc.date.available2021-10-21T12:28:21Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23136
dc.source.conferenceIMAPS European Microelectronics Packaging Conference - EMPC
dc.source.conferencedate9/09/2013
dc.source.conferencelocationGrenoble France
dc.title

RF characterization and modeling of through-silicon vias

dc.typeProceedings paper
dspace.entity.typePublication
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