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Conference contributions
Biocompatible and flexible packaging for implantable electronic devices
Publication:
Biocompatible and flexible packaging for implantable electronic devices
Date
2011
Meeting abstract
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Qian, Karen
;
Op de Beeck, Maaike
;
Malachowski, Karl
;
Miyazaki, Tomokazu
;
O'Callaghan, John
;
Van Hoof, Chris
Journal
Abstract
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1966
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations
Metrics
Views
1966
since deposited on 2021-10-19
Acq. date: 2025-10-23
Citations