Publication:

Biocompatible and flexible packaging for implantable electronic devices

Date

2011
Meeting abstract
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dc.contributor.authorQian, Karen
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorMalachowski, Karl
dc.contributor.authorMiyazaki, Tomokazu
dc.contributor.authorO'Callaghan, John
dc.contributor.authorVan Hoof, Chris
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorO'Callaghan, John
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.date.accessioned2021-10-19T17:46:41Z
dc.date.available2021-10-19T17:46:41Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19639
dc.source.conference3rd Flexible & Stretchable Electronics Workshop
dc.source.conferencedate15/11/2011
dc.source.conferencelocationBerlin Germany
dc.title

Biocompatible and flexible packaging for implantable electronic devices

dc.typeMeeting abstract
dspace.entity.typePublication
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