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Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-0790-5190
cris.virtual.orcid0000-0001-9248-9496
cris.virtual.orcid0000-0003-0945-2786
cris.virtual.orcid0000-0002-4766-4360
cris.virtual.orcid0000-0003-1145-4676
cris.virtual.orcid0000-0001-5655-3470
cris.virtual.orcid0000-0002-4667-5092
cris.virtual.orcid0000-0002-9820-8146
cris.virtual.orcid0000-0001-9586-8424
cris.virtual.orcid0009-0003-9297-2156
cris.virtual.orcid0000-0001-6608-9990
cris.virtual.orcid0000-0001-8803-3824
cris.virtual.orcid0000-0003-3971-5938
cris.virtual.orcid0000-0001-9073-5745
cris.virtual.orcid0000-0002-8374-1466
cris.virtual.orcid0000-0003-0111-431X
cris.virtual.orcid0009-0000-4159-5627
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtualsource.department22ccd7d9-b8fb-4eb8-a848-5ad916ed9881
cris.virtualsource.department37100c79-97ff-4c90-8a44-4ebc848be45d
cris.virtualsource.department64529ee2-36a3-4eef-ab86-ba4e78c7ca24
cris.virtualsource.department6971fa7b-67f1-4411-ae6d-17af529e3bde
cris.virtualsource.departmentfb9678dc-d1da-4c02-abb9-b9e60161e405
cris.virtualsource.departmentfdf8a7b1-1237-4855-8fb1-b6cd39ad0ad8
cris.virtualsource.department269e99b3-e865-45a6-be00-65dcb446d66d
cris.virtualsource.departmentb32be2a6-49e5-4859-8aac-84fd4f5bec8e
cris.virtualsource.department90cbe746-d27a-4632-a668-a5f7c6a01321
cris.virtualsource.department435d309d-6c96-4aab-89d4-959fcbbd141c
cris.virtualsource.departmente0516903-cddd-40de-89a1-f2edc789e372
cris.virtualsource.department7897aa7a-0c43-4929-b5ef-9f5606dd37c6
cris.virtualsource.departmente666f90e-dd44-45bd-84ab-803d7c6b5823
cris.virtualsource.department60c132e2-4328-4858-8310-738625cccbdd
cris.virtualsource.departmentdfce6263-0b14-47ec-bcd3-a2f4456b6a0e
cris.virtualsource.departmenteb6f7727-278e-4dc4-8e38-517dc3f5c61a
cris.virtualsource.departmentba97b4e2-c6d5-45c4-b9b4-75cedecd7d74
cris.virtualsource.department1ae3c5c1-0114-40d9-804f-b5a8fb557ec9
cris.virtualsource.departmenta416d47f-1ae3-45a8-8e35-e7812989e681
cris.virtualsource.departmentbc81c64d-580a-4d9d-b5b2-6dff1033b67c
cris.virtualsource.orcid22ccd7d9-b8fb-4eb8-a848-5ad916ed9881
cris.virtualsource.orcid37100c79-97ff-4c90-8a44-4ebc848be45d
cris.virtualsource.orcid64529ee2-36a3-4eef-ab86-ba4e78c7ca24
cris.virtualsource.orcid6971fa7b-67f1-4411-ae6d-17af529e3bde
cris.virtualsource.orcidfb9678dc-d1da-4c02-abb9-b9e60161e405
cris.virtualsource.orcidfdf8a7b1-1237-4855-8fb1-b6cd39ad0ad8
cris.virtualsource.orcid269e99b3-e865-45a6-be00-65dcb446d66d
cris.virtualsource.orcidb32be2a6-49e5-4859-8aac-84fd4f5bec8e
cris.virtualsource.orcid90cbe746-d27a-4632-a668-a5f7c6a01321
cris.virtualsource.orcid435d309d-6c96-4aab-89d4-959fcbbd141c
cris.virtualsource.orcide0516903-cddd-40de-89a1-f2edc789e372
cris.virtualsource.orcid7897aa7a-0c43-4929-b5ef-9f5606dd37c6
cris.virtualsource.orcide666f90e-dd44-45bd-84ab-803d7c6b5823
cris.virtualsource.orcid60c132e2-4328-4858-8310-738625cccbdd
cris.virtualsource.orciddfce6263-0b14-47ec-bcd3-a2f4456b6a0e
cris.virtualsource.orcideb6f7727-278e-4dc4-8e38-517dc3f5c61a
cris.virtualsource.orcidba97b4e2-c6d5-45c4-b9b4-75cedecd7d74
cris.virtualsource.orcid1ae3c5c1-0114-40d9-804f-b5a8fb557ec9
cris.virtualsource.orcida416d47f-1ae3-45a8-8e35-e7812989e681
cris.virtualsource.orcidbc81c64d-580a-4d9d-b5b2-6dff1033b67c
dc.contributor.authorChen, Ye
dc.contributor.authorAkritidis, Konstantinos
dc.contributor.authorChen, Kai-Wen
dc.contributor.authorDe Jaeger, Lisa
dc.contributor.authorDe Witte, Jasper
dc.contributor.authorGamez, Arturo Fernandez
dc.contributor.authorGarrido, Miquel Fausti Cherta
dc.contributor.authorKiewiet, Max
dc.contributor.authorLi, He
dc.contributor.authorLin, Chupao
dc.contributor.authorMatuszek, Krzystof
dc.contributor.authorNenezic, Patrick
dc.contributor.authorNiels, Margot
dc.contributor.authorBonito Oliva, Valeria
dc.contributor.authorPoelman, Stijn
dc.contributor.authorReep, Tom
dc.contributor.authorTran Thi Ngoc Lam
dc.contributor.authorVanackere, Tom
dc.contributor.authorVan Severen, Lucas
dc.contributor.authorWithouck, Jorik
dc.date.accessioned2026-11-02T14:45:10Z
dc.date.available2026-11-02T14:45:10Z
dc.date.createdwos2026
dc.date.issued2026
dc.description.abstractThis paper highlights micro-transfer printing (MTP) as a promising scalable approach to heterogeneous integration for silicon photonics. MTP uniquely achieves high integration density, high throughput, and high material efficiency through a low-temperature, back-end integration process. Current demonstrations, including integrated III-V lasers and thin-film electro-optic modulators, confirm MTP’s potential. Industrial adoption requires resolving challenges related to final integration yield and throughput, device reliability, and supply chain maturity.
dc.description.wosFundingTextThis work was supported in part by PhotonixFAB under Grant 101111896, in part by STARLIGHT under Grant 101194170, in part by PHOTONMED under Grant 101139777, in part by HAETAE under Grant 101194393, in part by INSPIRE under Grant 101017088, in part by PUNCH under Grant 101070560, in part by PHORMIC under Grant 101070332, in part by MEDPHAB under Grant 871345, in part by CALADAN under Grant 825453, in part by PATTERN under Grant 101070506, in part by VISSION under Grant 101070622, in part by AMICA under Grant 101158577, and in part by MOLOKAI under Grant 101159440.
dc.identifier.doi10.1109/jlt.2026.3689409
dc.identifier.issn0733-8724
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60687
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage6825
dc.source.endpage6839
dc.source.issue16
dc.source.journalJOURNAL OF LIGHTWAVE TECHNOLOGY
dc.source.numberofpages15
dc.source.volume44
dc.subject.keywordsQUANTUM-DOT LASERS
dc.subject.keywordsINTEGRATION
dc.subject.keywordsISOLATOR
dc.subject.keywordsFILM
dc.title

Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook

dc.typeJournal article
dspace.entity.typePublication
imec.internal.crawledAt2026-09-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-09-07
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