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Impact of advanced patterning options, 193nm and EUV, on local interconnect performance

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dc.contributor.authorStucchi, Michele
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDemuynck, Steven
dc.contributor.authorSiew, Yong Kong
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorSiew, Yong Kong
dc.date.accessioned2021-10-20T16:33:43Z
dc.date.available2021-10-20T16:33:43Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21564
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate4/06/2012
dc.source.conferencelocationSan Jose, CA US
dc.title

Impact of advanced patterning options, 193nm and EUV, on local interconnect performance

dc.typeProceedings paper
dspace.entity.typePublication
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