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Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications
Publication:
Improving The Wafer Thinning Flow Robustness For 2.5D & 3D Applications
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Date
2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712091
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jedidi, Nader
;
Kennes, Koen
;
Phommahaxay, Alain
;
Guerrero, Alice
;
Beyer, Gerald
;
Beyne, Eric
Journal
N/A
Abstract
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254
since deposited on 2025-02-15
Acq. date: 2025-12-11
Citations
Metrics
Views
254
since deposited on 2025-02-15
Acq. date: 2025-12-11
Citations